1992 ARTICLE INDEX This index lists the articles published in Semiconduc- ties of 500 or more. Contact Kim Leffew, Cahners tor International in 1992, by the following categories: Co., Reprint Services, 1350 E. Touhy Ave., Processing, Assembly and Testing. Reprints are avail- P.O. Box 5080, Des Plaines, IL 60018-3358 (708) 635- able on a custom basis at reasonable prices in quanti- 8800 or (800) 323-4958. PROCESSING Robert S. Christ, May, p. 130. Singer, Dec., p. 36. “Relating Device and Process Parame- “FPD Lithography: System Technology “Navigating to Advanced Wafer Proc- ters,"’ Edward Sill, Mary Ann Kiesle, Pushed to the Limit,” Pieter Burggraaf, essing,’ Robert J. Kopp, Ph.D., Jan., p. May, p. 138. Dec., p. 42. 34. “Resist Implant Problems: Some Solved, “How Specialty Gas Delivery Impacts Others Not,” Pieter Burggraaf, June, p. ASSEMBLY the Uptime Equation,” Ron Iscoff, Jan., 66. p. 44. “Using ‘Six Sigma’ to Gauge PECVD,” “Assembly Automation: How Much is “Access to Japan’s Market by Foreign Gregg Bartlett, Jon Dahm, Karen Map- Too Much?" Ron Iscoff, May, p. 86 Manufacturers,’’ Shigetoshi Kiura, Jan., pin, Clark S. Stone, Evert van de Ven, “Thin Outline Packages: Handle With p. 58. June, p. 94. Care!,"’ Ron iscoff, June, p. 78. “Lithography’s Leading Edge, Part 1: “Bernas Source Engineering increases “The Mystery of the Cracked Dice: A De- Phase-shift Technology,’ Pieter Implanter Utilization,’’ Santos Garza, tective Story,”” Roy Buck, June, p. 124. Burggraaf, Feb., p. 43. Rinn Cleavelin, Ph.D., Richard Hull, ‘“Backgrinding Wafers for Maximum Die “Stripping Today’s Toughest Resists,” Bryan Wessels, Dee McCall, June, p. Strength," Shawn Lewis, July, p. 86. Laura Peters, Feb., p. 58. 106. “The Probe Card Dilemma," Betty New- “In Situ Contro! of Photoresist Coating “Modeling the Continuing Realm of Op- boe, Sept., p. 64. Processes,” T.E. Metz, R.N. Savage, tical Lithography,’’ Donald W. Johnson, “Contract Assembly at the Crossroads,"’ H.O. Simmons, Feb., p. 68. Chris A. Mack, June, p. 134. Ron Iscoff, Sept., p. 70. “Europeans Collaborate to Meet World “To Subsidize or How To Subsidize? “Plastic Packaging: The Once and Fu- Market Challenges,” Brian Dance, Feb., That is the Question!,”” Raymond Boult, ture King,"’ Ron Iscoff, Oct., p. 62. p. 72. June, p. 170. “Are MCMs the New Packaging “Searching for Perfect Planarity,”’ Peter “Trends in Plasma Sources: The Search Champ?,” Ron Iscoff, Dec., p. 48. H. Singer, March, p. 44. Continues,”’ Peter Singer, July, p. 52. “Lithography’s Leading Edge, Part 2: |- “PECVD: A Versatile Technology,”’ TESTING line and Beyond,” Pieter Burggraaf, Robert D. Compton, July, p. 60. March, p. 52. “A Robust Gate Dielectric for Submicron “High Speed GaAs: Still a Niche Tech- Technology,’’ Hsing-Huang Tseng, Philip “Can You Trust Your Liquid Particle nology?,”’ Ron Iscoff, March, p. 60. J. Tobin, July, p. 68. Monitor?,”’ Peter H. Singer, Jan., p. 52 “Pre-pump Scrubbers Simplify Mainte- “Semiconductor Technology — The Uni- “Wanted: The Perfect Tool for Both CDs nance and Improve Safety,’ Peter H. versity Resource,"’ R.M. Burger, July, p. and Overlay,” Betty Newboe, Feb., p. 50. Singer, March, p. 72. 78. “Trends in Vacuum Gauging,” Peter H. “Specialty Gas Cylinders: Help “The Fab of the Future: Concept and Singer, March, p. 78. Wanted,”’ Ron Iscoff, April, p. 42. Reality,"’ Kiaus C. Wiemer, James R. “Software Used to Evaluate Two Posi- “Top Fabs of 1992,’’ Betty Newboe, Burnett, July, p. 92. tive Resists,’’ Laurie B. Union, April, p. April, p. 50. “Stepper-track Integration: Solving the 70. “Trends in CMOS Development,” Peter Problems," Pieter Burggraaf, Aug., p. “Predicting Probe Yields for VLSI H. Singer, April, p. 56. 30. Chips,” Douglas Shade, May, p. 102. “Choosing a Semiconductor Cleanroom “The Multiple Challenges of Tungsten “RGAs Tackle Multi-process Monitor- Contractor,”” Betty Newboe, April, p. 64. Deposition,”’ Peter Singer, Aug., p. 36. ing,’ Betty Newboe, June, p. 72. “Plasma Etch Chemistry: The Untold “The Cleanroom Enigma,” Paul L. Ol- “The Remarkable Trend in Defect Den- Story,’’ Laura Peters, May, p. 66. iphant, Sept., p. 82. sities and Chip Yields,”” James A. Cun- “Evaluating Plasma Etch Damage,” Pe- “TOC Levels in Incoming Chemicals,’’ ningham, June, p. 86. ter H. Singer, May, p. 78. Mark J. Camenzind, Marjorie K. Balazs, “Stress Voids: How to Measure and Ver- “Atmospheric Pressure CVD Used for Sept., p. 89. ify at the Wafer Level,’’ John Finn, June, Si-Ge,"’ Douglas J. Meyer, Ph.D., Ted |. “What's the Status of 200 mm Wafers?,"’ p. 112. Kamins, May, p. 95. Pieter Burggraaf, Oct., p. 49. “Environmental Effects on Resist Thick- “Stacked Capacitor Structures for 64Mb “Sputtering Tools: Still on Target?,"’ Ron ness Uniformity,"’ Meron Reihani, June, DRAMs and Beyond,” Pierre C. Fazan, Iscoff, Aug., p. 42. p. 120. Hiang C. Chan, Viju K. Mathews, May, “SEMATECH Examines MFC Non- “Failure Analysis: From ‘Postmortem’ to p. 108. linearity,"” David Neilsen, Oct., p. 72. ‘Preventive’,"’ Pieter Burggraaf, Sept., p. “SACVD: A New Approach for 16Mb Di- “20 Good Reasons to Use In Situ Parti- 56. electrics,” J.G. Lee, S.H. Choi, T.C. Ahn, cle Monitors,” Laura Peters, Nov., p. 52. “Film Stress and How to Measure It,”’ C.G. Hong, P. Lee, K. Law, M. Galiano, “Vacuum ‘Cluster’ Tools: Rethinking the Peter Singer, Oct., p. 54. P. Keswick, B. Shin, May, p. 116. Fab, Pieter Burggraaf, Nov., p. 70. “PVD On-line Process Control Through “Pratical Gettering in High Temperature “Boost Process Tool Uptime witn Better In Situ Monitoring,” W.E. Frank, |. Ruge, Processing,’’ Damon DeBusk, Jeff Van Vacuum System PM,” Ron Iscoff, Nov., P. Kucher, H. Helneder, Nov., p. 60. Wagner, Juanita Chambers, May, p. 124. p. 76. “New Test Controls Gold Wire Bond- “Specifying 100 mm GaAs Wafers,”’ “Trends in Wafer Cleaning,” Peter ing,” Alan A. Facer, Nov., p. 84. 94/SEMICONDUCTOR INTERNATIONAL DECEMBER 1992