NASA/CR---- _2 7 - 207765 Final Report: NAG8-1138 //Z/" / Adaptive Full Aperture Wavefront Sensor Study Final Report Period of Grant: 1 April 1995 to 31 Aug 1997 Grant Number: NAG8-1138 Prepared by William G. Robinson, Principal Investigator Electro-Optics, Environment, and Materials Laboratory Georgia Tech Research Institute Georgia Institute of Technology Atlanta, Georgia 30332 FinaRl eportN:AG8-1138 Adaptive Full Aperture Wavefront Sensor Study Table of Contents Page 1.0 Introduction 1 2.0 Scope of Work 1 3.0 SSD Top-Level Technology Demonstration Requirements 2 4.0 Magnetic Edge Sensor Development 2 4.0 Background 3 4.1 CMOS Sensor Procurement 4 4.2 Magnetic Coil Fabrication 5 4.3 Flex Circuit and Edge Sensor Packaging Design 6 5.0 Optical Position Sensors 8 5.1 Young's Double Slit Interferometer 8 5.2 Laser Diode Optical Feedback Displacement Sensors 8 5.3 Integrated Optics Michelson Interferometer (IOMI) 8 5.4 Integrated Optic Interferometer Position Sensor (lOPS) 8 5.5 Absolute Displacement Sensor Using Moir6 Fringe Techniques 8 6.0 Wavefront Sensing Techniques for The Next Generation Space Telescope 9 7.0 Conclusions 9 7.1 Edge Sensors 9 7.2 Wavefront Sensing for NGST 9 8.0 Recommendations 10 8.1 Edge Sensors 10 8.2 Wavefront Sensing forNGST 10 9.0 Acknowledgments 10 10.0 References for Section 5.0 10 Appendix A: Statement of Work A-1 Appendix B: Seven Segment Demonstration Program Plan, Rev 2. B-1 Appendix C: Wavefront Sensing Techniques for the Next Generation C-1 Space Telescope Final Report: NAG8-1138 Adaptive Full Aperture Wavefront Sensor Study 1.0 Introduction. This final report describes the work performed by Georgia Tech Research Institute during the period of I April 1995 to 31 August 1997, under Grant No. NAG8-1138. This grant and the work described was in support of a Seven Segment Demonstrator (SSD) and review of wavefront sensing techniques proposed by the Government and Contractors for the Next Generation Space Telescope (NGST) Program. A team developed the SSD concept. The team involved personnel from NASA Marshall Space Flight Center (MSFC), Naval Air Warfare Center-Weapons Division (NAWC-WPNS), SY Technologies (SYT), Blue Line Engineering (BLE), and Georgia Tech Research Institute (GTRI). The Program Manager for the effort was Mr. E. (Sandy) Montgomery at MSFC. For completeness, some of the information included in this report has also been included in the final report of afollow-on contract (H-27657D) entitled "Construction of Prototype Lightweight Mirrors". The original purpose of this GTRI study was to investigate how various wavefront sensing techniques might be most effectively employed with large (>10 meter) aperture space based telescopes used for commercial and scientific purposes. However, due to changes in the scope of the work performed on this grant and in light of the initial studies completed for the NGST program, only aportion of this report addresses wavefront sensing techniques. The wavefront sensing techniques proposed by the Government and Contractors for the NGST were summarized in proposals and briefing materials developed by three study teams including NASA Goddard Space Flight Center, TRW, and Lockheed-Martin. In this report, GTRI reviews these approaches and makes recommendations concerning the approaches. The objectives of the SSD were to demonstrate functionality and performance of a seven segment prototype array of hexagonal mirrors and supporting electromechanical components which address design issues critical to space optics deployed in large space based telescopes for astronomy and for optics used in spaced based optical communications systems. The SSD was intended to demonstrate technologies which can support the following capabilities; * Transportation in dense packaging to existing launcher payload envelopes, then deployable on orbit to form a space telescope with large aperture. • Provide very large (>10meters) primary reflectors of low mass and cost. • Demonstrate the capability to form a segmented primary or quaternary mirror into a quasi- continuous surface with individual subapertures phased so that near diffraction limited imaging in the visible wavelength region is achieved. • Continuous compensation of optical wavefront due to perturbations caused by imperfections, natural disturbances, and equipment induced vibrations/deflections to provide near diffraction limited imaging performance in the visible wavelength region. • Demonstrate the feasibility of fabricating such systems with reduced mass and cost compared to past approaches. While the SSD could not be expected to satisfy all of the above capabilities, the intent was to start identifying and understanding new technologies that might be applicable to these goals. 2.0 Scope of Work. The original purpose of this GTRI study was to investigate how various wavefront sensing techniques might be most effectively employed with large (>10 meter) aperture space based telescopes used for commercial and scientific purposes and to develop risk-reduction prototypes, in selected areas, to minimize development risks of future investigators. However, due to changes in the scope of the work performed on this grant and in light of the initial studies completed for the NGST program, only a portion FinaRl eportN:AG8-1138 of this study addressed wavefront sensing techniques. The wavefront sensing techniques proposed by the Government and Contractors for the NGST were summarized inproposals and briefing materials developed by three study teams including NASA Goddard Space Flight Center, TRW, and Lockheed-Martin. In this report, GTRI reviews these approaches and makes recommendations concerning the approaches. The original statement of work for this contract is shown in Appendix A. Changes in the original scope of work were made in consultation with the COTR (E. Montgomery) in an effort to meet the technical goals of the SSD; schedule constraints presented by the program, and cost limitations of this grant. This report describes the actual work completed on this grant. 3.0 SSD Top-Level Technology Demonstration Requirements. The following list of top-level technology demonstration requirements was taken from the Seven Segment Demonstrator Project Plan, Revision 2; The goal of the SSC is to demonstrate: • Phase locking of a segmented mirror surface. • Compact (miniaturized) phase loop controller capable of continuous phasing mirrors at a bandwidth in excess of 300 Hz. • Compact (miniaturized) phase loop controller architecture expandable to many more segments and a tip/tilt control loop for full aperture wavefront correction. • Miniaturized, high accuracy, high dynamic range edge sensors. • Miniaturized, high accuracy, high dynamic range, moderate bandwidth, and lightweight actuators. • Very lightweight mirror segments. • Simple, reliable, robust construction and deployment methods and mechanisms. • Stiff cluster baseplates for support of segmented mirror arrays. The SSD component developments were treated as a precursor to constructing a much larger curved aperture made up of many more segments. The guidelines and assumptions developed to serve as hardware and software requirements for the SSD were documented in the Seven Segment Demonstrator Project Plan, Revision 2. These requirements are included in this report in Appendix B. 4.0 Magnetic Edge Sensor Development. The mirrors in the SSD are used to form aquasi-continuous surface, with minimal wavefront deviation. To make the seven smaller segments form a continuous surface like one large mirror; the edges of the segments must match in tilt and piston (displacement). The relative position of the edges of the hexagonal mirrors segments are measured using edge sensors and this relative position is used as feedback for the servo control system. The edge sensors must have the following properties; • Large positional dynamic range (+/- 200 lamor larger) • Good resolution (<4 nm rms or less) • Fairly low non-linearity ( 1% or less of range) • Good frequency response (10 kHz or higher) Magnetic position sensor developed by Kaman Aerospace on an Air Force program called PAMELA met the above requirements, but were difficult and expensive to produce in large quantities. The SSD program goal was to develop a magnetic sensor similar to the Kaman sensor, but less expensive. FinaRl eportN:AG8-1138 4.1 B.ackground. Prior to GTRI joining the SSD development team, BLE and SYT developed a magnetic position sensor concept to meet the requirements listed above. The original SSD edge sensor design included two integrated circuit die, each one mounted on adjacent edges of a mirror as shown in Figure 4.1-1. 0 Back of Mirror Back of Mirror Back of Mirror Back of Mirror Back of Mirror Back of Mirror Back of Mirror PositionSensor _ _ PositionSensor I_irrorSubstra,e _,l!MirrorSubstrate • /'x /'x Figure 4.1-1 Schematic of SSD showing position sensors on adjacent mirror edges. FinaRl eportN:AG8-1138 Asoriginalleynvisioneeda,chedge sensor circuit had the identical layout, but were interconnected differently depending on its use as a passive or active element. Each sensor pair has one passive coil pair and one active coil pair. The sensor circuit, shown in Figure 4.1-2, contains (1) pads for connection of two coils, (2) drive/oscillator circuitry, (3) and an array of electrical interconnect pads. In the original sensor concept, two coils were to be attached to each circuit and the interconnect pads were to be configured using external bond wires and flex circuitry as shown in Section 4.4. Figure 4.1-2 Position sensor circuit. 4.2 CMOS Sensor Procurement. The sensor circuit was designed by SYT and fabricated by the MOSIS Fabrication Service. The circuits were fabricated with two circuits per die as shown in Figure 4.2-1. Figure 4.2-1 Photograph of position sensor die showing two identical sensors on the same die. 4 Final Report: NAG8-1138 A total of 44 die (88 sensor circuits) were purchased by GTRI from the MOSIS Fabrication Service. GTRI also had the task of dicing the die into two separate die, each containing one sensor circuit. The MOSIS Fabrication Service is a service offered by the University of Southern California, acting through its Information Sciences Institute, which provides a means of obtaining relatively low cost prototyping and small volume production of custom and semi-custom VLSI circuits. Available processing include the following technologies; 2.0 micron CMOS (Analog, NPN transistor, 2 Poly) 1.2 micron CMOS (Analog, NPN transistor, 2Poly) 1.2 micron CMOS (Digital w/capacitor option) 0.8 micron CMOS (Digital) 0.5 micron CMOS (Digital) 0.8 micron GaAs (Digital). MOSIS provides this service by combining designs from various users onto one mask set and then contracting with major commercial IC vendors to fabricate the circuits. Once the wafers are fabricated, MOSIS cuts the wafer into individual die and sends the die to the user or the individual chips can be packaged (including wire bonding) by MOSIS in a number of standard commercial packages. The MOSIS Service has a web site at www.isi.edu and can be reached by telephone at 310-822-1511. 4.3 Magnetic Coil Fabrication The small coils to be used with the circuits were required to have more inductance than is feasible with normal integrated circuit processing techniques so a special process was employed to fabricate the coil pairs. The coils were produced by the North Carolina Micro-machining Center (NCMC), using the LIGA process, The LIGA process is capable of producing miniature nickel coils that have a thickness-to- width ratio of 4or 5 to 1with very straight walls. This allowed the small coils to have the inductance necessary for this application. The LIGA coils are shown in Figure 4.3-1. Figure 4.3-1 Photograph of small coils made with LIGA process. The more traditional way of producing similar coils in the past was by actually winding the coils with special wire on special bobbins. The previous technique was very labor intense, time consuming, and produced low yields due to assembly problems. FinaRl eportN:AG8-1138 4.4 Flex Circuit and Edge Sensor Packaging Design Several edge sensor packaging concepts were developed which used the position sensor dies, LIGA coils, and flex-circuits provided by NASA Ames. One of the key components to all of the concepts was the flex circuits used to interconnect the position sensors mounted on the edge of the mirrors with the electronics used to control the mirror actuators. Several commercial companies were contacted to determine the suitability of standard products, but all of the "off-the-shelf' products found were unsuitable for this application and custom products were too expensive for our budget. Prior to GTRI's participation in this program, SYT had discussed with NASA Langley Research Center the possibility of using anew polyimide material they had developed called LaRC-SI. LaRC-SI is a polyimide type of material, which can be laid down in very thin layers, which allows for a very flexible membrane with good electrical properties. When GTRI joined the program and it became GTRI's responsibility to provide edge sensor packaging designs, Nancy Holloway, at Langley Research Center, was contacted to further investigate how various flex circuits might be developed. Early flex circuit designs had eight traces, as shown inFigure 4.4-1, to accommodate all of the power and signal connections required to operate the sensor circuit. Initial concepts used wire-bonding between circuit pads on the silicon die to circuit pads on the polyimide flex circuits, as shown in Figure 4.4-2. Figure 4.4-1 Early flex-circuit showing 8traces Wirebond pads onchip are.100mmsquare,on .200ramcenters r- o Transition ,_o__ Area o o \\ o_ \\ 0.400mm widetraceso,n.800mm centers 25 urn alia. bona wires 0.200mm widetraceso,n0.300mm centers Figure 4.4-2 Early sensor-flexcircuit interconnect design 6 Final Report: NAG8-1138 For various reasons, these concepts proved to be too labor intense (expensive), too fragile, or required special bonding equipment that was not standard in the industry. GTRI finally settled on the design shown inFigures 4.4-3 and 4.4-4. L_ Figure 4.4-3 Final sensor-flex circuit interconnect design • Silver palter,\ Laser drilled hole Figure 4.4-4 Photograph of final bonding technique. This design is simple, robust (does not require fragile wire bonds), and allows a large number of prototype packages to made fairly quickly using simple fixturing. Details of this packaging scheme are described in the final report entitled "Construction of Prototype Lightweight Mirrors" on Contract H-27657D. Final Report: NAG8-1138 5.0 Optical Position Sensors. As aparallel risk reduction effort, optical position sensor concepts were considered. During this short study a number of designs were identified through a literature search. The literature search provided the following interesting concepts; 5.1 Young's Double Slit Interferometer. A paper by C.W. Gillard, et al °)describes aform of Young's double slit interferometer using an light emitting diode and white light source that allows measurement of (1) relative piston between two mirror segments, (2) the gap between the segments, and (3) the relative tilt between the segments. The technique is reported to give piston accuracy (rms) of 0.013/am, gap accuracy (rms) of 1.6 _am,and tilt accuracy of 0.02 arc sec (110 mad). This approach uses a CCD array as a readout device. From a packaging standpoint, one major advantage that this technique has isthat all of the electronics are located off the segments on the backup structure. 5.2 Laser Diode Optical Feedback Displacement Sensors. Three papers were found that describe the use of external cavities with the Fabry-Perot cavities of laser diodes to produce modulation of the laser diode output as a result of changes in the external cavity position. The paper by J. Kato, et al _2_describes a technique that allows displacement measurement accuracy of+/- 100 nm over a range of Imm Another paper by P. de Groot _3)describes a similar experiment using external laser diode cavities to measure displacements of a piezo-electric driven mirror. The third paper by J. Remo '')describes, in amore theoretical way, analysis of external cavity laser diode based edge sensors. In this paper the external cavity is defined by a calibrated diffraction grating. 5.3 Integrated Optics Michelson Interferometer (IOMI). Two papers by John Remo _3)describe the selection and use of externally coupled and internally placed laser diodes in an integrated optics chip utilizing aMichelson interferometer design. The papers specifically address the use of this type of integrated optic device for piston and tilt measurements of segmented mirror reflectors for power beaming applications. The results indicate that the prototype "can provide precise distance measurements from 20 nm to a few millimeters with a very small standard deviation" (1.2-1.8 nm) and tilt measurements from 1to about 100 micro-radians. 5.4 .Integrated-Optic Interferometer Position Sensor (IOPS). This paper by Shogo Ura, etal _ describes an integrated optics device that includes two planar interferometers, two photodetectors, an externally coupled laser diode, and three types of grating structures to couple laser energy to an externally movable mirror and provide the reference beams for the interferometer. The author reports a measurement resolution of about 10nm can be achieved, provided a stable laser wavelength. Mirror-to-sensor range of up to 15cm provided high enough visibility to obtain the 10nm resolution. The unique part of this device is the use of various grating structures in the design and of course the large apparent dynamic range. 5.5 Absolute Displacement Sensor Using Moir6 Fringe Techniques. This paper by Barry Jones and Graeme Philp _)describes a technique for using fiberoptics and gratings to produce a displacement sensor based on Moir6 fringe effects. The heart of the system is a four channel "interpolator" to measure the phase angle of the fringes. The prototype sensor described is usable over a range of 100 urn, with a resolution on the order of 12nm. The author also discusses a multi- wavelength sensor using wavelength multiplexing to reduce the number of fiberoptics required to operate the sensor.