इंटरनेट मानक Disclosure to Promote the Right To Information Whereas the Parliament of India has set out to provide a practical regime of right to information for citizens to secure access to information under the control of public authorities, in order to promote transparency and accountability in the working of every public authority, and whereas the attached publication of the Bureau of Indian Standards is of particular interest to the public, particularly disadvantaged communities and those engaged in the pursuit of education and knowledge, the attached public safety standard is made available to promote the timely dissemination of this information in an accurate manner to the public. “जान1 का अ+धकार, जी1 का अ+धकार” “प0रा1 को छोड न’ 5 तरफ” Mazdoor Kisan Shakti Sangathan Jawaharlal Nehru “The Right to Information, The Right to Live” “Step Out From the Old to the New” IS 15214 (2002): Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology [LITD 5: Semiconductor and Other Electronic Components and Devices] “!ान $ एक न’ भारत का +नम-ण” Satyanarayan Gangaram Pitroda ““IInnvveenntt aa NNeeww IInnddiiaa UUssiinngg KKnnoowwlleeddggee”” “!ान एक ऐसा खजाना > जो कभी च0राया नहB जा सकता हहहहै””ै” Bhartṛhari—Nītiśatakam “Knowledge is such a treasure which cannot be stolen” IS 15214:2002 lEC/PAS 62119 (1999) rn m-+ahf-lwm WT=mrTi 1+-!ll-icf Indian Standard GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY ICS 31.180 0 BIS 2002 BUREAU OF INDIAN STANDARDS MANAK BHAVAN, 9 BAHADUR SHAH ZAFAR MARG NEW DELHI 110002 I September 2002 Price Rs 800.00 \ .J Printed Circuits Sectional Committee, LTD 17 NATIONAL FOREWORD This Indian Standard which isidentical with IEC/PAS 62119(1999) ‘Genericrequirements for implementation of product manufacturing description data and transfer methodology’ issued by the International Electrotechnical Commission (IEC) was adopted by the Bureau of Indian Standards on the recommendation of Printed Circuits Sectional Committee and approval ofthe Electronics and Telecommunication Division Council. The text of the IEC/PAS document has been approved as suitable for publication as Indian Standard without deviations. Certain conventions are,however, notidentical tothoseusedinIndian Standards. Attention isparticu- larly drawn tothe following: a) Wherever the words ‘International Standard’ appear referring to this standard, they should be read as ‘Indian Standard’. b) Comma (,) has been used asadecimal marker while inIndian Standards, the current practice isto usea point (.) asthe decimal marker. CROSS REFERENCES Thetechnical committee responsible forthepreparation ofthisstandard hasreviewed theprovisions ofthefollow- ingInternational Standards and has decided that they are acceptable for use inconjunction with this standard: lPC-T-50 Terms and definitions for interconnecting and packaging electronic circuits WC-2512 (ADMIN) Sectional requirements for implementation of administrative methods for manufacturing data description IPC-2513 (DRAWG) Sectionalrequirementsforimplementationofdrawingmethodsformanufacturing data description .,.-.--” IPC-2514 (13DFAB) Sectional requirements for implementation of printed board fabrication data description IPC-2515 (BDTST) Sectionalrequirementsforimplementationofbareboardproductelectricaltesting i data description IPC-2516 (BDASM) Sectionalrequirementsforimplementationofassembledboardproductmanufacturing data description IPC-2517 (ASEMT) Sectional requirements forimplementation ofassembly in-circuit testing data description IPC-2518 (PTLST) Sectionalrequirements forimplementation ofpart listproduct datadescription IPC-2519 (MODEL) Sectional requirements forinformation model datarelated totheprinted board andprinted board manufacturing description IPC-2521 PWB fabrication dataquality rating system IPC-2522 Bareboard electrical testdata quality rating system IPC-2523 Printed board assembly data quality rating system IPC-2524 In-circuit testdata quality rating system IPC-4101 Laminate/prepreg materials standard for printed boards (i) As in the Original Standard, this Page is Intentionally Left Blank IS 15214:2002 lEC/PAS 62119(1999) TABLE OF CONTENTS 1 SCOPE ............................................................................................................................................ ............. 1 1.1 I~ENWTAmON ........................................................................................................................................l 1.2 GENCAMFWUS .......................................................................................................................................l 2 APPLICABLE DOCUMENTS ....................................................................................................................1 3 REQUIREMENTS ....................................................................................................................................... 2 3.1 CA~GORY CLASS~CAmON .......................................................................................................................2 3.1.1 Categories and Content.....................................................................................................................3 3.2 CHARAmER DEHNImON ............................................................................................................................4 3.3 nWOWRULES .......................................................................................................................................4 3.4 PAWME~R RWES ....................................................................................................................................5 3.4.1 Alpha.numetic Paramete~ ................................................................................................................5 3.5 COORDINA~RULES ...................................................................................................................................5 3.6 TRANSFORMATIONCHARACTERISTICS.................i......................................................................................6 3.6.1 Scalefactor description.....................................................................................................................7 I 3.6.2 Rotation andmimor attributes...........................................................................................................7 3.7 DATAORGmEAmON ~DID~mHCATION Ru~ .....................................................................................8 3.7.1 USEDIN............................................................................................................................................ 8 3.7.2 Eqlicit Definition............................................................................................................................. 9 3.7.3 FileReadabiliy ................................................................................................................................. 9 4 GENERAL RULES .....................................................................................................................................9 4.1 DESCWWIONOFnIMITIVES .....................................................................................................................10 4.2 GENCAM ~ImVEENHANCEMENT DESC~ORS ........................................................7.........................10 4.2.1 LineEnhancemen tDescriptors&INEDESC)...................................................................................10 4.2.2 PAINTparameters ~~NTDESC) ...................................................................................................13 4.2.3 RulesofPrecedence ........................................................................................................................ 14 ------“” 4.2.4 Rulesfor ShapeDescriptions...........................................................................................................14 4.3 STANDmD GRWHIC~IMITIVES ..............................................................................................................15 4.3.1 Stra”ghtline &INE)......................................................................................................................... 15 4.3.2 Ch-culararc (CIRCMC ) .................................................................................................................16 4.3.3 Ellipse arc @LLIPARC)... ...............................................................................................................17 4.4 GENCAM ST~DmDSIMPLE~MITIVES ................................................................................................ 17 4.4.1 Circle (CIRCLE)............................................................................................................................. 18 4.4.2 RectangJecorner @CTCO~ER) ..................................................................................................18 4.4.3 Rectangle Center ~CTCE~TER) ..................................................................................................19 4.5 GENCAM STANDARDCOMPLEXPRIIWTIVES............................................................................................20 4.5.1 RectangJe,ChamferedComers @CTCHM) .................................................................................20 4.5.2 Rectangle, RoundCorners~CTROUND) .....................................................................................21 4.5.3 Rectangle, RoundedEnds(OVAL)...................................................................................................22 4.5.4 Rectangle, One-Sided (DSHAPE)....................................................................................................22 4.5.5 Rectangle, Rotated @IMOND) ......................................................................................................23 4.5.6 HE~GON ...................................................................................................................................... 24 4.5.7 OCTAGON...................................................................................................................................... 25 4.5.8 THEMALS .................................................................................................................................... 25 4.6 GENCWUSER.DEFND mIMITIWS ......................................................................................................29 4.6.1 POLKINE ...................................................................................................................................... 29 4.6.2 POLYGON...................................................................................................................................... 30 4.7 DESCHON OFmWORKS (m~ORKS) ............................................................................................32 4.7.1 TARGETS....................................................................................................................................... 34 4.7.2 FEATURE....................................................................................................................................... 37 4.7.3 Textparameters ~E~ ..................................................................................................................39 4.7.4 User-defined charactersets (UFONT)...A........................................................................................40 4.7.5 LOGOS... ........................................................................................................................................ 41 4.7.6 PA~ERNS ..................................................................................................................................... 42 (iii) IS 15214:2002 lEC/PAS 62119(1999) 4.7.7 ARwORKPAWERNPAWETER SUMMARY............................................................................46 4.8 SECTIONS .............................................................................................................................................48 4.8.1 4.8.2 4.8.3 4.8.4 4.8:5 4.8.6 4.8.7 4.8.8 4.8.9 4.8.10 4.8.11 4.8.12 4.8.13 4.8.14 4.8.15 4.8.16 4.8.17 4.8.18 4.8.19 4.8.20 4.8.21 5 MODELING ............................................................................................................................................ 121 5.1 ACTIWTYADNIN FORMATIONMODELS ................................................................................................... 123 6 STANDARD SEMANTIC RULES .......................................................................................................... 123 6.1 THEGENCAMFILE................................................................................................................................ 123 6.2 ALPHAN. UMER]CPARAMETER..S.............................................................................................................125 6.3 GENCAMPARAME~RUNITS................................................................................................................ 125 6.4 DESCRIPTIONOFGENCAMSTANDARDMODIFIERS................................................................................. 125 6.5 DESCRWTIONOFGENCAMSTANDARDGRAPHICPRIMITIVE.S.................................................................126 6.6 DESCRIPTIONOFGENCAMST.~NDARDSIMPLEPRIMITIVE..S................................................................... 127 6.7 DESCRE’TIONFGOENCAM STANDARDCOMPLEXPRIMITIVE.S................................................................127 6.8 GENCAMDESCRIntONOFUSERPRIMITIVE.S........................................................................................ 129 6.9 GENCAMUSERENHANCED“ IN-PROCESSP”RIMITIVE.S.......................................................................... 129 6.10 DESCRIPTIONOFGENCAMS TANDARDPRIMITIVEENHANCER.S.......................................................... 132 7 REPORT GENERATORS ......................................................................................................................133 8 REFERENCE INFOWATION ............................................................................................................. 133 8.1 IPC (l) .................................................................................................................................................. 133 8.2 AMERICA~NAT]ONASLTANDARDISNSTITUTE(2)................................................................................... 134 8.3 DEPARTMENOT~DEFENSE(3)................................................................................................................ 134 8.4 ELECTRONICINDUSTRIEASSSOCIATIO(N4)............................................................................................. 134 8.5 INTERNATIONAOLRGANIZATIOFNORSTANDARD(SISO) ......................................................................... 134 8.6 INTERNETENGINEERINTGASKFORCE(IETF) STANDARD.S..................................................................... 134 9 APPENDICES .......................................................................................................................................... 137 APPENDIX A Beginning andEnding SectionKeywords ............................................................................... 135 APPENDIX B Statement Keywords...............................................................................................................136 APPENDIX CFixed Field Pmameters ............................................................................................................139 APPENDIX D Device Type Pmameters .........................................................................................................143 APPENDIX E Device Pin Type Parameters ................................................................................................... 144 APPENDIX F Package Type Pwmeters ........................................................................................................ 145 APPENDIX G Package PinType Pmameters................................................................................................. 147 APPENDIX H Drawing Type Pmameters.......................................................................................................148 (iv) 1’ IS 15214:2002 lEC/PAS 62119(1999) Indian Standard GENERIC REQUIREMENTS FOR 1MPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY 1 SCOPE This standard specifies data file formats used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, inspection and testing requirements. These formats may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The files are also useful when the manufacturing cycle includes computer-aided processes and numerical control machines. The information can be used for both manual and for digital interpretations. The data may be defined in either English or S1units. 1.1 Interpretation “Shall”, the emphatic form of the verb, is used throughout this standard whenever a requirement is intended to express a provision that is mandatory. Deviation from a shall requirement is not permitted, { and compliance to test modules (CTMS), developed to check syntax and semantics, is required to ensure the correct relationships between entities in a file. I The words “should” and “may” are used whenever it is necessary to express non-mandatory provisions. “Will”’[~ used to express a declaration of purpose. To assist the reader, the word shall is presented in bold characters. 1.2 GenCAM Focus , ----- The GenCAM format requirements are provided in a series of standards focused on printed board manufacturing, assembly, inspection, and testing. This standard series consists of a generic standard (IPC-25 11) which contains all the general requirements. There are seven sectional that are focused on .> the details necessary to accumulate information in the single GenCAM file, that addresses the needs of the manufacturing disciplines pro ducing a particular product. The sectional standards (lPC-2512 through 2518) paraphrase the important detailed requirements and provide suggested usage and examples for the topic covered by the sectional standard. 2 APPLICABLE DOCUMENTS The following documents contain provisions which, through reference in this text, constitutes provisions of the IPC-2510 series of standards. All documents are subject to revision and parties who make agreements based on this generic standard are encouraged to investigate the possibility of applying the most recent editions of the documents indicated below. IPC-T-50 Terms and Definitions” for Interconnecting and Packaging Electronic Circuits IPC-2512 (ADMIN) Sectional Requirements for Imple~entation of Administrative Methods for Manufacturing Data Description IX-25 13 (DRAWG) Sectional Requirements. for Implementation of Drawing Methods for Manufacturing Data Description IPC-2514 (BDFAB) Sectional Requiremefits for Implementation of Printed Board Fabrication Data Description IPC-2515 (BDTST) Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description 1 -: .!% ? , . , J IS 15214:2002 ‘+ lEC/PAS 62119(1999) ;’q .! .... :, IPC-2516 (BDASM) Sectional Requirements for Implementation of Assembled Board Product , 7 Manufacturing Data Description : IPC-2517 (ASEMT) Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description IPC-2518 (PTLST) Sectional Requirements for Implementation of Part List Product Data ~’ ;. .. Description \ ~ IPC-2519 (MODEL) Sectional Requirements for Information Model Data Related to the Printed T;: , Board and Printed Board Manufacturing Descriptions < IPC-2521 PWB Fabrication Data Quality Rating System ,! IPC-2522 Bareboard Electrical Test Data Quality Rating System IPC-2523 Printed Board Assembly Data Quality Rating System IPC-2524 In-Circuit Test Data Quality Rating System IPC-41 01 Larrtinate/Prepreg Materials Standard for Printed Boards 3 REQUIREMENTS The generic computer-aided manufacturing (GenCAM) format specifies data sections specifically for information interchange of data related to printed board manufacturing, assembly, inspection, and test. GefiCAM is comprised of twenty sections. These are shown in Tables 3-1<and 3-2. Each section has a specific function or task respectively and is independent of each other. Accordingly, the information interchange for a specific purpose is possible only if the sections required for such a purpose have been prepared. 3.1 Category classification Table 3-1 provides the name and purpose of each of the twenty sections. .--” i ADMINISTRATION Describesthe orderinginformationnecessaryforidentifyingresponsibility,quantity6forderedparts anddeliverysch e dule. I FIXTURES Describesfixturingforbareboardandassembledboardtesting. PANELS Panelization;includesdescriptionofmanufacturingpanelsforprintedboardsanddescriptionof assemblyarrays. BOARDS Descriptionofboardandcoupons;includesoutlineofboardkoupon,cutouts,toolingholes. DRAWINGS Describesengineeringdrawingandformattingrequirementsforcompleteprintedboardandprinted boardassemblydescriptions. PRIMITIVES Describessimpleandcomplexprimitivephysicalshapes;includeslands,holes,standardpatterns. ARTWORKS Functionalandnonfunctionalgeometriesdevelopedbytheuser,i.e.usermacros;includesshapes, logos,featuresnotpartofthecircuitandotheru~er-definedfigures. PATTERNS Descri~tionforuserstobuildlibrariesofnwsableDadsandmdstacks. MECHANICALS Mechanical information; includes handles, nuts,bolts, heatsinks,brackets,holes. I LAYERS I Boardmanufacturingdescriptions;includesconductivehonconductivelayerdefinitionofsilkscreens, / I details ofdielectrictolerances, separations andthickness. I PADSTACKS CAD systemda~, includes pads anddrilling information throughtheboard. I PACKAGES Describesalibraryofcomponentpackages;includestruepackagedimensions. FAMILIES Isusedtodescribelogicfamiliesofcomponents. DEVICES Componentdescription;includesdevicepartnumber. COMPONENTS Usedtoidentifycomponents;includesreferencedesignatorswhereappropriate. L