High-Speed and Lower Power Technologies Electronics and Photonics Devices, Circuits, and Systems Series Editor Krzysztof Iniewski Wireless Technologies Circuits, Systems, and Devices Krzysztof Iniewski Circuits at the Nanoscale Communications, Imaging, and Sensing Krzysztof Iniewski Internet Networks Wired, Wireless, and Optical Technologies Krzysztof Iniewski Semiconductor Radiation Detection Systems Krzysztof Iniewski Electronics for Radiation Detection Krzysztof Iniewski Radiation Effects in Semiconductors Krzysztof Iniewski Electrical Solitons Theory, Design, and Applications David Ricketts and Donhee Ham Semiconductors Integrated Circuit Design for Manufacturability Artur Balasinski Integrated Microsystems Electronics, Photonics, and Biotechnology Krzysztof Iniewski Nano-Semiconductors Devices and Technology Krzysztof Iniewski Atomic Nanoscale Technology in the Nuclear Industry Taeho Woo Telecommunication Networks Eugenio Iannone For more information about this series, please visit: https://www.crcpress. com/Devices-Circuits-and-Systems/book-series/CRCDEVCIRSYS High-Speed and Lower Power Technologies Electronics and Photonics Edited by Jung Han Choi Krzysztof Iniewski MATLAB® and Simulink® are trademarks of the MathWorks, Inc. and are used with permission. 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CCC is a not-for-profit organization that provides licenses and registration for a variety of users. For organizations that have been granted a photocopy license by the CCC, a separate system of payment has been arranged. Trademark Notice: Product or corporate names may be trademarks or registered trademarks, and are used only for identification and explanation without intent to infringe. Library of Congress Cataloging‑in‑Publication Data Names: Choi, Jung Han, editor. | Iniewski, Krzysztof, 1960- editor. Title: High-speed and lower power technologies : electronics and photonics / Jung Han Choi and Krzysztof Iniewski, editors. Description: Boca Raton : Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T&F Informa, plc, 2018. | Series: Devices, circuits, and systems | Includes bibliographical references and index. Identifiers: LCCN 2018026596| ISBN 9780815374411 (hardback : alk. paper) | ISBN 9781351242295 (ebook : alk. paper) Subjects: LCSH: Low voltage integrated circuits. | Integrated optics--Power supply. | Electronic apparatus and appliances--Energy conservation. | Very high speed integrated circuits. Classification: LCC TK7874.66 .H54 2018 | DDC 621.3815--dc23 LC record available at https://lccn.loc.gov/2018026596 Visit the Taylor & Francis Web site at http://www.taylorandfrancis.com and the CRC Press Web site at http://www.crcpress.com Contents Contents Special thanks to my parents for their endless love and support Contents Preface ......................................................................................................................ix Series Editor .........................................................................................................xiii Editor.......................................................................................................................xv Contributors ........................................................................................................xvii 1 The End of Moore’s Law and Reinventing Computing ..........................1 Suhas Kumar 2 When the Physical Disorder of CMOS Meets Machine Learning .......9 Xiaolin Xu, Shuo Li, Raghavan Kumar, and Wayne Burleson 3 SiGe BiCMOS Technology and Devices ..................................................37 Edward Preisler 4 Base Doping Profile Engineering for High-Performance SiGe PNP Heterojunction Bipolar Transistors .................................................59 Guangrui (Maggie) Xia and Yiheng Lin 5 Performance Evaluation of AsF5-intercalated Top-Contact Multilayer Graphene Nanoribbons for Deeply Scaled Interconnects ...............................................................................................125 Rohit Sharma and Atul Kumar Nishad 6 Silicon-on-Chip Lasers for Chip-level Optical Interconnects ..........141 Il-Sug Chung 7 Integrated Photonic Interconnects for Computing Platforms ..........165 Nicola Andriolli, Isabella Cerutti, and Odile Liboiron-Ladouceur 8 Ultra-Low Power SiGe Driver-IC for High-Speed InP Mach-Zehnder Modulator .........................................................................187 Jung Han Choi 9 Efficient and Low-Power NoC Router Architecture ............................211 Gul N. Khan 10 Rapid Static Memory Read-Write for Energy-Aware Applications......................................................................253 Theodoros Simopoulos, Themistoklis Haniotakis, George Ph. Alexiou, and Nicolas Sklavos vii viii Contents 11 Application Specific Integrated Circuits for Direct X-Ray and Gamma-Ray Conversion in Security Applications .............................269 Kris Iniewski, Chris Siu, and Adam Grosser 12 High-Efficiency Power Amplifiers ..........................................................309 Guillermo Velasco-Quesada, Herminio Martínez-García, and Alfonso Conesa-Roca Index .....................................................................................................................345 Preface Advances in semiconductor technologies over the last few years have led to such rapid and considerable improvements with respect to speed, power, integration density, and cost, that the semiconductor device, especially the Si CMOS gate length, is now approaching the theoretical quantum limit of its feature size. Many academic institutions and industries are aggressively investing their efforts in discovering next-generation technologies in every area: for example, nano devices using carbon-based materials, new struc- ture-materials, heterogeneous material systems to form optics in Si, and high-temperature superconducting materials. In addition, technological evolutions like quantum computing and quan- tum communications, which it was believed would take at least a decade to make practically available, are now already on the horizon. People are start- ing to bring their attention to those areas to work out feasible future appli- cations combined with IoT, 5G, and beyond 5G. One distinct area that has recently attracted a lot of interest from many research institutions is artificial intelligence, particularly since AlphaGo, developed by Google Deepmind, won a Go match against 18-time world human champion, Lee Sedol. This his- toric event inspired many engineers to dig into the enormous possibilities of artificial intelligence in ever-developing electronic machinery and all sorts of engineering areas. Machines embedded with artificial intelligence even began mimicking human intelligence in part and people seek to imagine applications in daily life. It is strongly anticipated that many electronics will embed AI in the near future. Also, the explosion of data traffic has triggered the development of higher- speed and lower-power intra-/inter-server communication modules for both data centers and communications. According to the survey by Cisco in 2016, global IP traffic will show 24% compound annual growth rate (CAGR) between 2016 and 2021, reaching 278 EB per month (EB = one bil- lion gigabytes).* It is reported that global electricity consumption by data centers is estimated at about 1.4% of global electricity consumption with a CAGR of 4.4% from 2007 to 2012†. It also contributes significantly to CO 2 emissions. The significant message we have to take from these statistical sur- veys is that we have to produce lower-power systems compared to old ones, supporting higher speed and lower complexity. One of the key elements in the data center as regards lower power-consumption is the interconnection * Cisco, “White Paper: Cisco Visual Networking Index: Forecast and Methodology, 2016– 2021.” Available at: www.cisco.com/c/en/us/solutions/collateral/service-provider/visual- networking-index-vni/complete-white-paper-c11-481360.html. † M. Avgerinou, et al., “Trends in Data Centre Energy Consumption under the European Code of Conduct for Data Centre Energy Efficiency,” Energies 2017, 10, 1470; doi:10.3390/en10101470. ix