Frequency-Domain Characterization of Power Distribution Networks For a listing of recent titles in the ArtechHouse Microwave Library, turn to the back of this book. Frequency-Domain Characterization of Power Distribution Networks Istvan Novak Jason R. Miller artechhouse.com Library of Congress Cataloging-in-Publication Data A catalog record for this book is available from the U.S. Library of Congress. British Library Cataloguing in Publication Data A catalogue record for this book is available from the British Library. ISBN-13: 978-1-59693-200-5 Cover design by Yekaterina Ratner © 2007ARTECHHOUSE, INC. 685 Canton Street Norwood, MA 02062 Allrightsreserved.PrintedandboundintheUnitedStatesofAmerica.Nopartofthisbook maybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includ- ing photocopying, recording, or by any information storage and retrieval system, without permission in writing from the publisher. Alltermsmentionedinthisbookthatareknowntobetrademarksorservicemarkshave beenappropriatelycapitalized.ArtechHousecannotattesttotheaccuracyofthisinforma- tion.Useofaterminthisbookshouldnotberegardedasaffectingthevalidityofanytrade- mark or service mark. 10 9 8 7 6 5 4 3 2 1 To our families Contents Preface xi Acknowledgments xv CHAPTER 1 Introduction 1 1.1 Evolution of Power Distribution Networks 1 1.2 The Importance of Frequency Domain 2 1.3 The Impedance Matrix 4 1.3.1 Size of the Matrix 6 1.4 When Time-Domain Characterization Is Useful 8 1.5 If and When Time-Domain Response Is Needed 8 1.6 The Characterization Process 9 1.7 The Modeling Process 10 References 11 CHAPTER 2 Simulation Methods and Tools 13 2.1 Spreadsheet Calculations 13 2.2 SPICE AC 15 2.3 MATLAB 16 2.4 Field Solvers 17 2.4.1 Classifications 18 2.4.2 Convergence 22 2.4.3 Sources of Simulation Inaccuracies 25 References 41 CHAPTER 3 Characterization and Modeling of Vias 43 3.1 Introduction 43 3.2 Via Partial Inductance 43 3.3 Via Loop Inductance 47 3.3.1 Measurement Correlation 54 3.4 Via Arrays 56 3.4.1 Measuring Via Arrays 57 3.4.2 Modeling Via Arrays 60 vii viii Contents 3.4.3 Parameterizing Via Arrays 61 3.4.4 Via Array Summary Points 65 References 65 CHAPTER 4 Characterization and Modeling of Planes and Laminates 67 4.1 Introduction 67 4.2 Analytical Plane Models 68 4.2.1 Analytical Models for Rectangular Plane Shapes 68 4.2.2 Analytical Plane Models for Arbitrary Plane Shapes 81 4.3 Transmission-Line Models 84 4.3.1 Transmission-Line Grid Models for Rectangular Plane Shapes 84 4.3.2 Transmission-Line Grid Models for Arbitrary Plane Shapes 86 4.3.3 Transmission Matrix Model for Arbitrary Plane Shapes 90 4.4 Effect of Plane Parameters on Self- and Transfer Impedances 92 4.4.1 Impact of Dielectric Thickness with Regular Conductors 92 4.4.2 Impact of Plane Thickness 94 4.4.3 Parallel Plane Pairs 96 4.4.4 Impact of Dielectric Constant and Dielectric Losses 96 4.4.5 Run Time Versus Number of Cells 97 4.5 Characterization of Plane and Laminate Parameters 98 4.5.1 DC Resistance of Planes 98 4.5.2 Measuring DC Resistance of Planes 100 4.5.3 Effect of Perforations on DC Plane Resistance 101 4.5.4 Simulating DC Voltage Drop and Effective Plane Resistance 102 4.5.5 Characterization of Mid- and High-Frequency Plane Parameters 102 References 120 CHAPTER 5 Impedance Measurements Basics 123 5.1 Selecting the Measurement Concept for PDN Impedance 123 5.2 The Importance of Two-Port Connections 126 5.3 Self- and Transfer Impedance 129 5.4 Transforming Measured S-Parameters 132 5.4.1 Measuring Self-Impedance with Magnitude |Z|<<25Ω 133 x 5.4.2 Measuring Arbitrary Self-Impedance Values 134 5.4.3 Measuring Large Impedance Values 136 5.4.4 Measuring Arbitrary Transfer-Impedance Values 137 5.4.5 Measuring Transfer Ratios 141 5.5 Extracting Component Parameters from Measured Data 143 5.5.1 Extracting Capacitance 143 5.5.2 Extracting Equivalent Series Resistance 145 5.5.3 Extracting Inductance 146 5.5.4 Estimating Inductance and Capacitance for Compensations 152 5.5.5 Fixture Compensation, Port Extension, and De-Embedding 154 References 158 Contents ix CHAPTER 6 Connections and Calibrations 159 6.1 Port Connections 159 6.1.1 Fixtures 159 6.1.2 Test Vias 165 6.1.3 Using Component Pads or Component Bodies as Test Points 169 6.1.4 Location of Test Points 174 6.2 Probes, Connectors, and Cables 175 6.2.1 Soldered Connections 175 6.2.2 Homemade Probes 176 6.2.3 Wafer Probes 180 6.2.4 Probe andDUTHolders and Probe Stations 180 6.2.5 Cables 181 6.3 Calibrations 183 6.3.1 VNACalibrations in the Low-Frequency Range 183 6.3.2 VNACalibrations in the Mid-Frequency Range 185 6.3.3 VNACalibrations in the High-Frequency Range 186 6.4 Stability and Accuracy of Measurements 188 6.4.1 Response Drift with Time 188 6.4.2 Instrumentation Settings 189 6.4.3 Probe Placement 191 6.4.4 Quality of Probe and DUTConnections 192 References 195 CHAPTER 7 Measurements: Practical Details 197 7.1 Making the Proper Connections 197 7.1.1 Eliminating Cable-Braid-Loop Error at Low Frequencies 197 7.1.2 Examples of Correct Connections 205 7.1.3 Measuring Low Impedances at High Frequencies 218 7.2 Making the Proper Measurements 220 7.2.1 Multiple Measurements, Multiple Instruments 220 7.2.2 Averaging, Smoothing, and Bandwidth 221 7.2.3 Background Noise, Noise Floor 224 7.2.4 Repeatability of Data 224 7.3 System Measurements 225 7.3.1 Measurements of Powered Boards 227 References 228 CHAPTER 8 Characterization and Modeling of Bypass Capacitors 229 8.1 Simple C-R-LModels and Spreadsheet Correlations 229 8.2 Wideband Characterization 232 8.3 Impact of Geometry on Electrical Parameters 234 8.3.1 How to Define ESL 234 8.3.2 Impact of Body Geometry on ESL of MLCC 239 8.3.3 ESR and ESL of Very Tall Capacitors 242