“Everything You Ever Wanted to Know About Lam- inates, But Were Afraid to Ask” 10th Edition Introduction to the “FAQ” Edition Dear Browser, It has been almost 30 years since the earliest edition of “Everything You Ever Wanted to Know About Laminates…but Were Afraid to Ask” was pounded out on an old TRS 80 (Trash 80) Computer. It has undergone periodic review and editing, including adaption for use on our website. (When I entered the industry Al Gore had not yet invented the internet.) Before I “retired” in 2004, we did another minor revision, but it was largely cosmetic, removing most references to the old military specification and introducing IPC-4101, the “new” IPC specification for laminate and prepreg materials. In 2009-2010 we did a total review, editorial rewrite and facelift. The 9th Edition incorporated not only the fundamentals which have not changed in 25 years, but recognized that the industry had moved a long way over the previous 5 years, and Arlon had a much more diversified line of high performance products serving a marketplace with evolving needs and priorities. Yes, we still are the premier manufacturer of polyimide laminate and prepreg -- and still supply a variety of materials for CTE control. But we also make a family of low flow materials, a line of thermally conductive materials and have entered the arena of lead-free and “green” products, to mention a few. What would have been considered a “high tech” multilayer board 25 year ago is being produced routinely now, and high tech has become altogether different and more complex. We tried to reflect a changing world in the 2009 9th Edition, and we continue to update in this 2013 10th (FAQ) Edition of “Everything…” When I entered the laminates industry in 1983 (when Arlon acquired Howe Industries) I knew almost nothing about the industry or the application of its products. It was a high intensity learning curve for me, with a lot of help from internal gurus and from our customers, who were always willing to share their knowledge and experience. I had to ask a million questions (usually several times) before I started to feel comfortable with it all. The original idea behind Everything…” was to answer the many questions our customers asked about high tech materials – which in large part turn out to have been the same ones I had asked for myself in my first few months in the industry. It wound up being a “best seller” and we “sold out” several early print editions. (The price was right, of course!) It would be impossible to personally thank everybody who has contributed to “Everything…” through the years, but in particular I want to mention Vince Weis, Arlon Technical Service, my mentor when I first entered the industry, and still my “go-to guy” when there is a question to which I don’t have an answer. I dedicate this 2013 FAQ Edition of “Everything…” as in 2009, to my many Arlon co-workers, industry peers and customers, so many of whom have been generous with their advice throughout the years, and without whom there would never have been an “Everything…” and with special kudos to Sandy Little, Arlon’s Sales and Marketing Coordinator, who provides the aesthetic and practical skills to make and maintain the FAQ Edition a working reality. In addition to this full downloadable pdf file, all the material in the 10th Edition is on-line at Arlon-med.com in the Technical Literature section under FAQ’s! Chet Guiles, Rancho Cucamonga, CA October, 2013 Table of Contents I. MATERIALS How are PWB Laminate Materials Classified? Is there an "Ideal" PWB Material or system? What Do We Need to Know About Epoxy Resins What do we Need to Know About Blended Resin Systems What are Polyimides and Why are They Used in PWB Laminates? What are Non-Traditional Resin Systems What are Some Typical Polyimide and Epoxy Products (Arlon Systems) How Do We Define High performance in Terms of PWB Materials? Define Glass Transition Temperature (Tg) and discuss its significance What determines "Continuous Operating Temperature" of a system Why do epoxies and polyimide turn brown when we exposethem to elevated temperature? Do resins require a postcure after laminating? Can we cure polyimide at 360 °F without a postcure? What are Dielectric Constant and Loss Tangent? What is Impedance? How do you calculate impedance? Given the normal variability in materials and process, can you design around the laminate dielectric properties you can get from your PWB manufacturer? What is the importance of the copper foil used on laminates? What is the difference between "rolled" and electrodeposited foil? How do you know which one to use for a given job? What is Copper Foil Treatment? What is Ohmega-Ply®? What is its application? What is HTE Copper? Why do we use it? What is Copper-Invar-Copper (CIC)? Why do we use it? What are its limits? What is Release Copper? Why do we use it? How is copper affected by Tg, operating temperature, etc.? What factors contribute to copper bond longevity? What governs the choice of which copper foil type or weight to use in a particular laminate? What Kinds of Reinforcements are Used in PWB Laminates and Prepregs? What are the differences between the common fiberglass fabric styles used in laminates? What is the basis for their choice and selection? What are "Warp" and "Fill?" What other terms are used to describe the direction of weave in fabric? Why is this important? What is "Weave Distortion?" What problems can it cause? What is S-Glass and why would we use it? What is Kevlar®? Where do we use it? What are the differences between quartz and standard E-glass? Why is quartz so expensive? When would we use it? What is Thermount®? (aka Nonwoven Aramid) II. PREPREG What is Prepreg? Briefly, how do we produce it? What is gel time? Why does IPC-4101 make gel time an "optional" test? What is resin content? Why is it important? How do we test for it and control it? What is flow? How do we test for and control it? Why is it important? What is Scaled Flow? How do we measure it? What does it tell us? Are there other flow test methods that may be more useful than the traditional Mil Flow and Scaled Flow tests now most widely used in the industry? What is ODR Used for? Why do we Need to Understand Rheological Testing? What are "No-Flow" (more accurately “Low-Flow”) Prepregs? What are the most common problems customers will encounter with prepreg? What do we need to know to help resolve those problems? How do we know what the "Shelf-Life" of various prepregs should be? What are the shelf life requirements for polyimide prepregs? Tell us more about moisture issues in prepreg? What about polyimide prepregs? Is moisture really a bigger issue with polyimides than with epoxy systems? Why does Arlon recommend vacuum desiccation of all prepregs prior to use. III. LAMINATE What is a Laminate? How Are Laminates Classified? What are the Most Important Laminate Properties? What is MIL-S-13949? What is IPC-4101? How Do I read an IPC-4101 Slash Sheet? How does our part number relate to the IPC-4101 line callout? Why can't we just use that callout as an internal part number? What testing does IPC-4101 require us to do? What is a QPL? What determines the thickness of a laminate? What do we mean by "buildup"? What thicknesses can we build and what buildups are typical of standard products? Why don't we recommend the use of single side clad laminate for use as cap sheets on multilayer boards? How does measurement of thickness by cross-section differ from measurement of thickness by micrometer? What difference does it make? What are the IPC-4101 requirements for thickness tolerance? How do we define them? Can we meet them all? Can we get Special Thicknesses, Tolerances? What are the "X", "Y" and "Z" axes of a laminate? What is their significance to our use of laminate? What is the significance of UL Recognition of polyimide laminates? What is a Cert? What do we include in a Cert/Test Report? How do we control traceability? What is IPC-4103? IV. PROCESSING How can a laminator be of assistance to its customers in defining processes or providing process information? What are the limitations of laminator-supplied processing recommendations? What are the “critical” process parameters that we need to be aware of? At what points in the manufacturing process must changes be made in handling high performance resins (i.e. polyimide and others) vs. FR-4? What special precautions must be taken with regard to moisture in high performance polyimide and some multifunctional epoxy prepregs? Talk to me some more about oxides? Why shouldn’t we use the traditional black oxide? The lighter red or brown oxides don't look right? What will be the biggest problems with oxiding? What Are “Oxide Alternatives”? What press cycles should we use for MLB lamination? What do we have to do to ensure that our product is properly cured? Why is the rate of heat-up critical? What issues might I encounter with out-of-norm pressure? How do I control prepreg flow? Why is vacuum lamination superior to conventional press lamination for high performance multilayers? How does it differ? We have heard a lot about dimensional stability. How can we get materials that are dimensionally stable? How is Dimensional Stability Characterized? Does Laminate Construction Affect Registration? What Methods are Available for Enhancing Registration? What determines drill speeds and feed rates? What are the best drilling conditions for use with polyimides? Why can’t I punch my polyimide boards? We hear a lot about Lead-Free Solder processing. What effect will higher solder temperatures have on my MLBs? How about processing Woven Kevlar® Materials? Are there any special precautions to take while processing aramid fiber reinforced boards? Are there any problems drilling or routing Kevlar®? How about Thermount? What are the process issues we will encounter with Thermount reinforced laminate systems? V. CONTROLLED CTE Why is the CTE of a MLB so important? What is CTE (Coefficient of Thermal Expansion)? Can we find CTE-Controlled Products in all Resin systems? What are the CTEs of the materials used in making MLBs? What is the CTE of a typical multilayer board? What are the available solutions to the CTE mismatch problem? Is there a "correct CTE" for a surface mount MLB? Why is the coefficient of thermal expansion of the laminate always greater in the Z-direction that in the X and Y axes in the plane of the laminate? Discuss the issue of total Z-direction expansion 50 to 260˚C What is The Schapery Equation? You mentioned an 0.006" CIC product. Tell us about that. How do we use it? Are there any limitations? How is Copper-Invar-Copper used? Is CTE the only reason for the use of a metal core in a PWB? Does the use of metal cores raise other issues? Sounds like a lot of issues with CIC. Are there solutions for any of them? What is Howefill 50®? How do we use it? When Would I use a Ceramic Filled Prepreg? Talk to us about woven aramid reinforced PWBs. What are the advantages of this system? Does Use of Woven aramid Reinforced Laminates have any disadvantages? There is still interest in quartz fabrics for CTE control. Why? Are there disadvantages of quartz fabric? Talk to us about Thermount? It looked like the ideal balance of cost/performance for Surface Mount PWBs. Where does that all stand? What is the downside of nonwoven aramid, if any? So what is Arlon doing about the nonwoven aramid supply issue? VI. ANALYTICAL METHODS What Analytical Methods are used in the PWB Laminates Industry? What is Thermomechanical Analysis (TMA) and why is it used? Can you define Tg in terms of TMA measurement, and discuss its significance? What is Differential Scanning Calorimetry (DSC)? What does DSC tell us about the resin systems we use in PWBs? Why do we use TMA instead of DSC to measure the Tg of polyimide systems. What is TGA (Thermogravimetric Analysis) and what do we learn from it? What is IR? (Infrared Spectrophotometry) What is Rheology? What kinds of flow (rheological) testing are available and what information do they provide? What does rheological characterization mean to you? What is a Parallel Plate or Oscillating Disc Rheometer (ODR)? How does the ODR present this data? What is Cone & Plate Rheometry? How do we measure Thermal Conductivity? What is the Importance of Thermal Conductivity? How do we Measure Dielectric Constant and Loss Tangent? What Mechanical Properties are Considered Important in PWB Materials? I. MATERIALS How are PWB Laminate Materials Classified? The popular names of the materials which comprise the majority of printed wiring board laminates have often been generalizations of the chemical names of the principal resin systems used in each, such as "Epoxy," "Poly- imide,” "PTFE" and the like. In recent years the search for products suitable for evolving high performance ap- plications have resulted in the use of new materials and combinations of materials that make the generalizations of the past somewhat more difficult to sustain. For instance, reference to “Epoxy” or “FR-4” is too general to accommodate the diverse requirements that characterize Low Flow, Multifunctional, Lead-Free, CAF Resistant, High Speed Digital and “Green” epoxy products. This diversification is reflected in the proliferation of slash sheets in IPC-4101, the laminate and prepreg spec currently in effect in the industry. (IPC-4101 is discussed in some detail in section III, “Laminates.”) Products can also be characterized in terms of intrinsic properties, resin system, end application or even substrate type. Some of the newer products, such as those based on laser drillable fiberglass, woven Kevlar®, Thermount®nonwoven aramid substrate or woven quartz reinforcement are frequently referred to by the generic name of the substrate rather than by the resin utilized, and of course all laminators including Arlon would like to have you all use our trade names rather than generic resin designators! (Naturally that would preclude you from referring to them by our competitors' trade names...) Many of the resins in use in the electronic laminates industry are thermosets (which means that they "cure" into a hard final product) rather than thermoplastics (which may be melted and re-melted). The most notable exception of course is the use of PTFE, or polytetrafluoroethylene (also known by its DuPont trade name as Teflon® although DuPont is not the only manufacturer of PTFE) in laminates for microwave and RF, where its dielectric properties are ideal for high frequency applications. Is there an "Ideal" PWB Material or system? If not, what would be the key elements of such a system? Because of the diversity of materials available and the wide range of applications, the concept of an “ideal laminate” has become fuzzy, to say the least. A material ideal for a high temperature application may be impractical in a microwave or high speed digital design, for instance. As a result, while we can list properties that are potentially important, each design team needs to establish a prioritization among them because no one material will have the optimal value for all the properties which might be considered important. Your laminate “cookbook” does have some common “ingredients” (i.e. properties) from which designers will be making choices during the design phase: Glass Transition Temperature (Tg): The highest temperature systems are polyimides (such as Arlon’s 35N, 33N and 85N) with Tgs of 250°C or above. Tg is a rough indicator of total Z-direction expansion and hence is considered a proxy for plated through hole reliability. A wide variety of epoxy systems in the 160-170°C range have found application where either process temperatures or in-use temperatures (or both) are less demanding. While Tg is a good frame of reference for traditional epoxy and polyimide materials, it is less reliable for reliability characterization of highly filled systems and for many of the non-traditional resin systems used in high frequency/low loss applications whose properties are composites of their various components. Example: Polyimide Thermount MLBs will survive 2-3x the thermal cycles of standard polyimide glass despite having identical resin and Tg because there are no stress concentrators caused by fiber bundles intersecting the walls of the plated through holes. Example: A filled PTFE product such as Arlon’s CLTE-XT microwave material does not have a Tg in the range of 50 to 260°C (PTFE does not exhibit a glass transition such as is seen in thermoset materials and its melt point is well above the use temperature range) but because of the low expansion filler, has a low and consistent Z-direction expansion in that range by virtue of which it will have excellent plated through hole reliability. 5 T260, T288 and T300values represent the length of time that a clad laminate will survive a particular temperature (respectively 260°C, 288°C and 300°C) before it begins to delaminate or blister. The test is performed in a TMA (Thermo-Mechanical Analyzer) and these values are considered good indicators of the short term resistance of products to solder processing; as such, they have become part of the Lead-Free minimum requirements as defined by IPC. Thermal Decomposition Temperature (Td): This property varies greatly with the chemical composition of materials, from the mid 300°C range for many epoxy systems to over 400°C for some polyimides. Td is the temperature at which a material begins to degrade thermally. Some data sheets will list a Td as the temperature at which a material has lost 5% of its original weight due to decomposition. A better indicator of performance would be the onset temperature, at which significant weight loss begins to occur. By the time a material, has lost 5% of its weight to decomposition it may well be unusable in many applications. Dielectric Constant and Loss Tangent: Dielectric constant determines the speed at which an electrical signal will travel in a dielectric material. Signal propagation speed is expressed relative to the speed of light in a vacuum, which is roughly 3.0 x 10 cm/sec. The dielectric constant of a hard vacuum (space) is defined as 1.00. Higher dielectric constants will result in slower signal propagation speed. Loss Tangent is a measure of how much of the power of a signal is lost as it passes along a transmission line on a dielectric material. These are determined by the inherent properties of the components of any specific resin system, although we normally refer to a “relative dielectric constant” because it is dependent on test method and frequency as well as material per-se. No one value of Dk is “ideal” for all applications. For many high speed digital applications, modified epoxy systems with dielectric constants in the range of 3.0 to 3.5 have been found to offer good cost-performance value. In other applications such as critical antennas, low noise amplifiers, etc., a very low loss material such as PTFE is optimal. Choice of specific material is as much driven by loss characteristics under use conditions as it is by the nominal Dk. For microwave and RF applications, pure PTFE on a fiberglass substrate, with a Dk of 2.1 and Loss of 0.0009, is the best available in wide commercial use. Consistency of dielectric constant is important for maintaining designed characteristic impedance (Zo) values. Registration (aka “Dimensional Stability”): All laminate materials to some degree on etching, and the key to proper registration is consistency both of product and process. The most suitable material would be one that moves minimally when it is etched, and has consistent and reproducible movement that would allow predictable factors for artwork compensation. The “ideal” material would not require artwork compensation at all, and would always register properly so as not to require drill compensation. The IPC test referred to as “dimensional stability” has at best a tenuous connection to the actual registration of a specific board design. Registration continues to be a key fabrication requirement for high layer count and HDI designs. Coefficient of Thermal Expansion (CTE, expressed in ppm/°C): CTE should be roughly matched to the expansion requirements of claddings, devices to be mounted on the surface and thermal planes buried in the interior. Current thinking says that for leadless ceramic chip carrier attachment, 6.0 ppm/°C is ideal. (At present, Arlon’s 45NK woven Kevlar®reinforced laminates with relatively low resin contents come closest to the 6.0 CTE ideal.) Other materials such as quartz reinforcement, Copper-Invar-Copper distributed constraining planes and nonwoven aramid reinforcement achieve values as low as 9-11, a substantial improvement over 17-18 for conventional epoxy or polyimide laminates, and have proven acceptable and consistent in a variety of SMT designs. Thermal Conductivity (Tc): As the density of components on a board increases due to demand for increasing functionality, and the overall surface areas of PWBs decrease, the watt-density of power being generated on a PWB increases. Critical devices exhibit failure rates that double for every 10°C of temperature increase, and so there is a push to have the thermal conductivity of the PWB materials themselves be high enough to help remove heat from devices on the surface of the board, without at the same time suffering in terms of electrical and dielectric properties. Target thermal conductivities to achieve significant reduction in board surface temperatures near active devices fall in the 1.0 to 3.0 W/m-K range, significant when compared with values of 0.25 to 0.3 W/m-K for traditional epoxy or polyimide systems. Arlon provides a number of thermally conductive thermoset 6 materials (such as 91ML at 1 W/m-K and 92ML at 2 W/m-K) as well as thermally conductive microwave materials such as TC350 and TC600. Z-Direction Expansion:Ideally the Z-direction expansion should match that of the copper in the plated through holes (about 17 ppm/°C) to avoid damaging the plated copper during thermal excursions resulting from process steps such as solder reflow. Most standard materials have CTEs of 50-60 ppm/°C below the Tg, and roughly 4x higher above the Tg. High Tg materials such as polyimide have less overall Z-direction expansion (about 1.1% from 50°C to 250°C) than typical epoxy systems (with about 3 to 4% from 50°C to 250°C) due to their higher Tg. Lead-Free Compatability: Lead-Free materials are materials able to withstand the higher soldering and reflow temperatures of lead-free solder systems. These may be anywhere from 30°C to 50°C higher than traditional lead-tin systems. Lead-free systems are usually characterized in terms of Tg (>155°C), T288 and T300 thermal resistance, Td (>330°C to 5% decomposition) and overall CTE (<3.5%). Materials such as polyimide have always been “lead-free” compliant, but newer generations of epoxy systems have had to be developed to meet the newer requirements. Lead-free is more complex than it might seem, since many current laminate materials will survive in “lead-free” applications, while some of the devices that are mounted on the boards have not even been tested at the higher lead-free temperatures. The overall thrust is to provide materials that will have a “margin of safety” across a range of higher lead-free solder temperatures. CAF Resistance: Copper Anodic Filament (CAF) growth between adjacent plated through holes can cause electrical shorts and intermittent performance in PWBs when a combination of ionic residues, physical pathway (such as a separation between resin and an individual fiberglass fiber) and a steady voltage differential between holes drives the deposition of electromigrated copper along a glass fiber. CAF is of particular interest to designers making large high performance boards that will be in use continually for long periods of time such as in high end servers. Realistic “specifications” for Pass-Fail have been difficult to define, and CAF issues can be as much related to board fabrication as to material choices. Laminators have found that proper resin formulation, engineered glass finish technology, and optimized processing can increase resistance to CAF formation. “Green” Laminate and Prepreg: The “green” requirement is driven as much by market considerations as by “good science.” Green materials are broadly defined as materials with UL-94 V0 flammability ratings achieved without the use of brominated flame retardants. Even though the brominated bisphenol-A that is used in most conventional FR-4 systems is NOT “banned,” non-governmental organizations (NGOs) such as Greenpeace, are pressuring to have “green” systems become the norm and hence are trying to force a move to non-brominated systems wherever possible. Some like to refer to non-brominated systems as “environmentally friendly,” although little long term work has been done to-date to assess the actual health or environmental impact of phosphorus compounds and other non-brominated systems. Modeled on the European Union’s RoHS (Recycling of Hazardous Substances) and WEEE (Waste Electrical & Electronic Regulation), many countries (and even individual states) have enacted or are in the process of developing regulations concerned with the content of electronic materials. To some degree this is a sort of technical minefield, because even if the various regulations are “normalized,” the cost of compliance to multiple independent and different regulations may become a significant part of the cost of a finished PWB. Uncomplicated Processing: The “ideal” laminate and prepreg system should be able to be processed using conventional photo-imaging methods, etching and wet chemical processing and lamination techniques. High process yields and process and design flexibility should be such that the material can be used in multiple designs with high probability of success. Unfortunately much of the industry still defines “normal process” as being that for conventional FR-4 and has tooled for that. Use of advanced materials in high performance MLBs will require some rethinking of what is “ideal” processing. 5 What Do We Need to Know About Epoxy Resins? By far the most common resin systems used worldwide in making PWBs are based on epoxies. Epoxies are relatively low in raw material cost, yet are capable of a wide range of formulation variations, Tg values from 110°C to as high as 170°C, and are very compatible with most PWB fabrication processes. Briefly: Difunctional Epoxies (FR-4) begin with brominated bisphenol-A epoxy resins and are formulated with accelerators (i.e. 2-methylimidazole, aka 2MI), hardeners (dicyandiamide, aka "dicy") and fillers (talc is cheap and improves drilling, silica and hollow glass spheres lower dielectric constant, etc.). There are a variety of epoxy products, distributed roughly by Tg into four basic categories: 1. Low end traditional difunctional systems (Tg range 110-130°C) 2. Modified Difunctional systems blended with tetrafunctional or multifunctional resins; (Tg range 135-160°C.) 3. Multifunctional epoxy systems; (Tg 165°C or above.) 4. Lead-Free multifunctional epoxy Systems (Tg 165-170°C) Tetrafunctional modified systems offer somewhat higher Tg due to the enhanced crosslinking, as well as better resistance to many of the solvents and chemicals used in board manufacture. Midrange difunctional modified systems offer improved performance in higher layer count designs, and multifunctionals ("Pure Multifunctionals") result in improved yields on high layer count designs where PTH reliability as well as resistance to measling (failure of resin adhesion at glass interstices) are problematic. Low-Flow epoxy systems are designed with restricted flow for applications such as heat sink bonding and rigid-flex PWB manufacture. Low-Flow systems are available in various Tg and flow ranges. Arlon manufactures several epoxy low-flow materials: • 47N (130°C Tg) is used primarily for heat sink bonding; • 49N (170°C Tg) is used in rigid-flex applications; and • 51N (Tg 170°C) is a “Lead-Free” Low Flow based on a thermally enhanced epoxy system for use in a wide range of applications. Lead-Free compatible epoxy systems are often formulated using phenolic resins and non Dicyandiamide (DiCy) cures to achieve higher decomposition temperature and significantly enhanced short term (process friendly) thermal stability. Thermally conductive epoxy systems are designed to have substantially higher Tc values than traditional epoxy systems. Typical values for thermally conductive epoxies range from 1 to 3 W/m-K compared to 0.25 W/m-K for traditional epoxy systems. Filled with thermally conductive fillers and based on lead-free resin technology, Arlon’s 91ML (1.0 W/m-K) and 92ML (2.0 W/m-K) are examples of second generation thermally conductive products. Thermally conductive systems promote heat transfer both vertically through the laminate and laterally within the laminate, to reduce temperatures at the board surface (i.e. device temperatures) by anywhere from 10 to 20°C compared to traditional systems. What do we Need to Know About Blended Resin Systems? Blends of different resin systems are also available, such as BT-Epoxy, BT-bismaleimide, Epoxy-Polyimide, Epoxy-PPO, etc. It is often assumed that blending will result in properties proportionally between the two primary blend components, but this assumption is not "scientific," and can lead to trouble. Note: The IPC Resin Technology Task Group has available a "Terms and Definitions" guide to assist in understanding the terms used in naming and describing resins and resin systems. Besides the names and definitions of common resins and additives, it also addresses such concepts as "blend", "cure", "crosslink", "filler", etc. The use of standard definitions might help us all be more precise in referring to various materials, avoiding a Pandora's Box of possible mix-and-match chemistries to assail the PWB designer. 6 What are Polyimides, and Why are They Used in PWB Laminates? Polyimide resins are used where high temperature is expected either in process or in application. The high Tg of polyimide (>250°C) makes it the optimum material for use in any of several applications or environments: • Where high process temperatures may result in latent defects in plated through holes (PTHs) the use of polyimides reduces the overall strain in a hole due to thermal processing, solder reflow, and the like. • Where the product will be subject to periodic field repair, or where devices will be repeatedly removed and re-soldered, polyimide resists pad lifting and other damage caused by repeated application of temperature. • Where the product’s application requires exposure to severe temperature conditions, such as in the case of “burn-in” testing of ICs or PWBs used in down hole drilling in oil exploration or geothermal projects. POLYIMIDES begin with addition polymerization of bismaleimides and maleic anhydride or other similar chemistries containing imide structures. There are three broad types of polyimides in common use today, newer generations of materials that overcome some of the issues with so-called “1st Generation” polyimides: the venerable (and since discontinued) Kerimid 601 products. 1.) "Pure Polyimides" including 2nd generation polyimides, such as Arlon's 85N, which do not have brominated flame retardants or other additives which reduce thermal stability, represent the ultimate in thermal stability and temperature resistance. 2.) 3rd Generation Polyimides, based on Kerimid 701 (Arlon 33N and 35N) provide tougher resins with improved flammability resistance (33N is UL 94 V0, and 35N is UL 94-V1). Accelerated polyimide cures in Arlon’s 33N and 35N systems have enabled somewhat lower temperature and shorter cures (as low as 90 minutes) than traditional “pure” polyimides. 3.) Filled polyimide systems such as Arlon’s 84N are used where clearance holes are needed in boards with, for example, heavier metal cores or ground planes. The filler (usually about 25-30% by weight) serves to reduce resin shrinkage, thus minimizing crack formation in filled areas either during cure and when the clearance holes are subsequently drilled. 4.) Low-Flow polyimides consist of bismaleimide resins, epoxy resins and the necessary catalysts, flow restrictors and accelerators appropriate to their formulation. Arlon's 37N and 38N No-Flow polyimides are examples of blended polyimides with Tgs around 200°C, used primarily in rigid-flex applications where polyimide materials are required for reliability, typically in commercial aerospace and military applications. 5.) 4th Generation advanced polyimides such as Arlon’s EP2, with improved adhesion to copper foil, reduced sensitivity to ambient moisture, reduced Z-direction expansion and improved registration stability have been developed by adjusting basic chemistry. What are Non-Traditional Resin Systems? The requirement for improved dielectric and loss properties has resulted in the development of a variety of blended products and the use of resin systems that are “non-traditional” in that they may use entirely different cure mechanisms (such as peroxide cures). Such systems may be based on materials that historically were not considered for traditional PWBs (such as polyolefins, blends with polyphenylene oxide/polyphenylene ether, etc.). Systems such as Arlon’s olefinic based 25N and 25FR offer improved electrical properties, but require a modified lamination process because of their peroxide cure system. Other systems are under development, some based on unique patented technology and aimed at the transition market between traditional systems and those requiring enhanced dielectric properties, as well as modified systems that enhance traditional materials in terms of performance and cost. 5